MID (Molded interconnected device)

Description

This spatially integrated switch support combines the function of a circuit board and the casing elements required by a switch, thereby facilitating optimal operation. The contours for the conductor paths are activated on this injection molded 3D part by a laser, electroplated and then fitted with electrical components.

  • Casing components as MID’s (Molded Interconnect Devices)
  • 3D component geometry provides design freedom and weight reduction at the same time
MID (Molded interconnected device)
Mike Radenbach
Mike Radenbach
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